The Catholic University of America

International Students Shine in Summer Engineering Internships

 

 

This July 43 talented Brazilian students presented research in the fields of biomedical engineering, civil engineering, electrical engineering and computer science, and mechanical engineering, among others, during a poster session held in Pangborn Hall.  The poster session served as the culmination of the Brazilian Scientific Mobility Program (BSMP) summer research internships hosted at The Catholic University of America (CUA), which enabled Brazilian students to conduct research alongside faculty members in the School of Engineering.

 

The BSMP summer internship program was managed by the Center for Global Education in partnership with faculty and staff in the School of Engineering.

 

Under the BSMP, Brazilian students receive scholarships to study at colleges and universities in the United States in the fields of Science, Technology, Engineering,  and Mathematics (STEM).  The program is funded by the Brazilian government and administered by the Institute for International Education.

 

In addition to gaining valuable academic and professional experience, students at CUA participated in trips to the Basilica of the National Shrine of the Immaculate Conception, the White House, the Smithsonian Air and Space Museum, and other points of interest around campus and in the DC metro area.